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  • Platform Ver.

    Suitable for mold, small workpiece
    Processing range:520*630*330

  • Ground Ver.

    Suitable for large workpieces
    Processing range: 1120*930*1150mm

Application
  • Uneven Surface Clean

    Control motion axes and laser head to clean according to the shape of workpiece

  • Stereoscopic Workpiece Clean

    Move laser head and motion axes to clean around stereoscopic workpieces

  • Non-standard Workpiece Clean

    Edit machining path by teaching demonstaration and perform automated clean

  • Through-Hole Clean

    Move laser head and motion axes to project laser into the hole to clean automatically

  • Mark on Any position

    Can mark Stereoscopic workpiece form any angle

  • Roughten

    Can perform repetitive process to roughen the surface

  • Deep-Caving

    Control motion axes X,Y,Z move to engrave workpieces horizontally and vertically

  • Wobble Line Cutting

    Control motion axes X,Y,Z move to cut workpieces horizontally and vertically

  • Rust
  • Oil Removal
  • Paint Removal
  • Pattern Marking
Advantage
  • Teaching Demonstration

    Don’t need 3D model、can perform automatic process

    Move laser head and edit the machining path through Teaching Deconstration. Control teaching pendant or touch screen to simulate machining path. After editting the path, can directly perform automated process

    1. Touch Screen
    2. Teaching pendant
  • 6 Motion Axes

    Can move laser head to workpiece any position and angle

    Coperate with Teaching Demonstration, control X、Y、Z axes, glavo front-back rotate, glavo left-right rotate, rotate disc for workpiece.

    1. XYZ axes move
    2. Front-back rotate
    3. Left-right rotate
    4. Workpiece rotate disc (optional)
    High Accuracy Repetitive Process

    Control laser marking and cleaning accuracy through motion axes and laser head Make sure process area won’t shifting, accuracy can up to ±0.01mm.

Process Mode
  • StaticProcess

    Laser Head & Workpiece fixed to clean/mark

    1. Static Cleaning
      Specific area cleans Control laser head and motion axes to move to any position and angle
      Repetitive clean Set different parameter for each clean and do repetitive clean on specific area
    2. Static Marking
      Specific area marking Control laser head and motion axes to move to any position and angle
  • DynamicProcess

    Laser head/workpiece move while cleaning

    1. Normal clean

      Can control laser and motion axes around workpiece to clean

    2. Repetitive clean

      Can set parameter for each clean to perform repetitive clean

    3. Automated component clean

      Can copy machining path and move to specific area for same path clean

Selection
Model Platform Ver.LSB-200/300-40-55-40-RO-140D Ground Ver.LSB-200/300-100-80-80-140L
Product Image    
Laser source Power 200W mopa 300W mopa 200W mopa 300W mopa
Pulse energy Single mode 2mj
Wavelength 1064nm
Frequency / Pulse width 1-3000KHz / 13-500ns
2D Glavo Scan speed ≤14000mm/s
Scan range 140*140mm
Virable focal length 248mm
Marking position accuracy ≤0.0176mm
User Operation Control System LSB Control System
Teach Pendant Handweel Teach Pendant (6 axes)
Touch Screen 10.1"
Platform
(Customizable)		 Size (Length, Width, Height) 1017*997*1687mm 1518*460*1010mm
Bearing 200kg *
Motion Range X axis: 1-400mm Y axis: 1-550mm Z axis: 1-400mm X axis: 1-1000mm Y axis: 1-800mm Z axis: 1-800mm
Max. Process area 520mm*630mm 1120mm*930mm
Max. process height 330mm 1150mm
Glavo left-right rotate angle Left 39°, Right 39° ±180°
Glavo front-back rotate angle ±100° ±160°
Rotate disc
(optional)		 Diameter 300mm *
Height 70mm *
Bearing 30kg *
Rotate angle 360° *
Applicability Suitable for mold, small workpiece Suitable for large workpieces
Work Demand Cooling Air Cooling
Working Temp. 0~40℃
Power Supply 110~220V，50/60HZ
Power Consumption 2500W
Details 60f92d25b8393.gif