Flexible pcb board marking, scribing, silicon wafer micro-hole, blind hole processing, LCD liquid crystal glass QR code marking,glassware surface drilling,metal surface coating marking, plastic buttons, electronic components, gifts, communications equipme
Product Features
Advanced small light spot design scheme, fine lines.
Precise optical path design and processing, weak processing energy attenuation.
XY axis scanning speed is ≤7000mm/s, 0 delay, meet the requirements of high-speed marking.
The Max. marking format can reach 300×300mm, which meets the requirements of large format engraving.
The Z-axis focal length range is variable, and it can carry out deep engraving, which is suitable for 3D applications such as relief and inner engraving.
During 3D deep marking processing, the Z-axis range is automatically adjusted to minimize the light spot and ensure the consistency of the object after marking and the graphic effect.
Fast speed, low drift, high positioning accuracy,reliable and stable operation, matching 355nm wavelength.
Used in optical scanning, laser marking, micro machining, glass inner carving, precision machining and other industries.
Specifications
| Scan Head Specifications | ||
| Model | UV-P10 | |
| Light aperture | 10mm | |
| Input spot | 7mm | |
| Focus model | Focus after | |
| Field Lens | 100*100mm (Multiple models according to requirement) | |
| XY axis speed | ≤7000mm/s | |
| Dynamic Z-axis speed | ≤3000mm/s | |
| Repeat scale accuracy | 5urad | |
| Adapt to laser power | ≤20W | |
| General protocol | XY2-100 protocol | |
| Operating deflection Angle | ±10 | |
| Max.Gain Drift | 50 | |
| Ambient temp | 0-50℃ | |
| Weight | 3KG | |
| Size | 201*95.4*96.5mm | |
Dimensions
